Ultra Cleaning with Supercritical CO2 Achieve sub-nanometer particulate and non-volatile organic residue removal for sensitive electronics, optics, and medical devices without toxic solvent waste or mechanical stress. 0 mN/m Surface Tension < 10 nm Feature Penetration 99.5% CO₂ Closed Loop Recycle 100% Dry Process (No Water) Explore our systems for Ultra Cleaning Core Advantages Zero ResidueComplete gas off-gassing upon depressurization ensures 0% solvent staining, water spots, or liquid entrapment. Solvent-FreeReplaces hazardous organic solvents like IPA, NMP, and acetone with non-toxic, non-flammable recycled CO₂. Micro-Pore PenetrationZero surface tension enables full cleaning inside high-aspect ratio channels, MEMS gaps, and 3D printed lattice meshes. Eco Closed-LoopIntegrated distillation recycles 99.5% of process CO₂, drastically cutting operational chemical expenses. Target Applications SemiconductorsRemoves photoresist remnants and sub-10nm etch particulates without pattern collapse on delicate nanostructures. Medical ImplantsExtracts machining lubricants and unreacted monomers from vascular stents, orthopedic implants, and catheters. PräzisionsoptikCleans space-grade mirrors, diffraction gratings, and infrared optics without micro-abrasion or drying spots. Additive ManufacturingFlushes un-sintered polymer/metal powders from internal cooling channels and porous lattice structures.